YV100XG

1) High-speed and high-precision multi-functional modular placement machine

2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)

3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)

4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns

5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components

6) Using 2 high resolution multi-vision digital cameras

7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls

8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss

9) The best choice for universal type

10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.

This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination

through both ends to drive and completes the acceleration function. Reduced positioning time.

    Board size M type: L460*W335(MAX)-L50*W50(MIN)

    L type: L460*W440(MAX)-L50*W50(MIN)

    Mounting Accuracy Absolute Accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP

    Mounting speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH

    Mountable Components 0603-31mm Components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA

    Dimensions 1650*1408*1900

Total weight 1600KG